IEC 60749-37:2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Standard No.
IEC 60749-37:2022
Release Date
2022
Published By
International Electrotechnical Commission (IEC)
Latest
IEC 60749-37:2022

IEC 60749-37:2022 history

  • 0000 IEC 60749-37:2022 RLV
  • 2008 IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer



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