IPC HDBK-630-2014
Guidelines for Design@ Manufacture@ Inspection and Testing of Electronic Enclosures

Standard No.

IPC HDBK-630-2014

Release Date

2014

Published By

IPC - Association Connecting Electronics Industries

Scope

This document has been written to assist the designers@ manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements@ ensuring the reliability and function of the end item assembly for its intended design life. An electronic enclosure@ for the purpose of this document@ is defined as a chassis@ box@ top level assembly@ high level assembly (HLA)@ functional unit@ drawer@ cabinet@ or other designation forming a top level system assembly. An enclosure typically consists of a combination of printed board assemblies (PBAs)@ cable and wire harness assemblies and other electronics and/or mechanical components@ and is typically tested as a functional unit. The enclosure includes the necessary mechanical and structural elements to protect and integrate the assembly into a finished system. Enclosures are often modular components or sub-systems of larger systems@ designed for replacement in the end-use environment. Purpose This handbook provides guidelines for the design@ manufacture@ inspection and test for electronic enclosures. It is not enough to understand the properties of the various components@ materials and processes; the user should understand what is to be achieved by the set of selected components@ materials and processes within the end use environment and how to verify that the desired results have been realized. This document is intended to be used as a reference only. It is the responsibility of the user to determine the suitability@ via appropriate testing@ of the selected electronic enclosure and application method for a particular end use application. An electronic enclosure may have several functions depending on the type of application. The most common are: a. To protect the electronic assembly from the end use environment@ such as vibration@ shock and other movements detrimental to electronic assemblies b. To incorporate into the end use environment.