IEC 60749-37:2022 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Standard No.

IEC 60749-37:2022 RLV

Release Date

2022

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-37:2022 RLV

IEC 60749-37:2022 RLV history

• 0000 IEC 60749-37:2022 RLV
• 2008 IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer