IPC SM-785-1992 chinese
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments

Standard No.

IPC SM-785-1992 chinese

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues