IPC - Association Connecting Electronics Industries
Scope
This test method provides a means to assess the propensity for conductive anodic filament (CAF) growth@ a form of electrochemical migration@ and similar conductive filament formation (CFF) laminate material failure modes within a printed wiring board (PWB). Conductive anodic filaments may be composed of conductive salts@ rather than cationic metal ions@ however inadequate dielectric for the applied voltage@ component failures@ and part use exceeding the maximum operating temperature (MOT) of the laminate can contribute to product failures as well. This test method can be used to assess PWB laminate materials@ PWB design and application parameters@ PWB manufacturing process changes and press-fit connector applications.