IPC - Association Connecting Electronics Industries
Scope
To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of ?55 ??to +130 ??and inorganic substrates (nonlaminated) with a range of ?55 ??to +150 ?? Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than ?200 ??to greater than +300 ?? however@ for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended.