IPC TR-486 CD-2001
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations
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IPC TR-486 CD-2001
Standard No.
IPC TR-486 CD-2001
Release Date
2001
Published By
IPC - Association Connecting Electronics Industries
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