IEEE P1838_D3.00, September 2019
IEEE Approved Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

Standard No.
IEEE P1838_D3.00, September 2019
Release Date
2019
Published By
Institute of Electrical and Electronics Engineers (IEEE)
Scope
IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking ...



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