IPC TM-650 2.4.18.1A-2004
Tensile Strength and Elongation@ In-House Plating

Standard No.

IPC TM-650 2.4.18.1A-2004

Release Date

2004

Published By

IPC - Association Connecting Electronics Industries

Scope

To determine the tensile strength in Mpa (PSI) and the elongation@ in percentage@ of electrodeposited copper plating at ambient temperatures by mechanical force testing.