IPC JEDEC-9703-2009 CHN
Printed Wiring Board Strain Gage Test Guideline

Standard No.

IPC JEDEC-9703-2009 CHN

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

Members of the JEDEC Reliability Test Methods for Packaged Devices Committee (JC-14.1) and the SMT Attachment Reliability Test Methods Task Group (6-10d) of the IPC Product Reliability Committee (6-10) have worked together to develop this document. We would like to thank them for their dedication to this effort. Any document involving a complex technology draws material from a vast number of sources. While the principal members of the SMT Attachment Reliability Test Methods Task Group are shown below, it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of JEDEC and IPC extend their gratitude.