IPC TM-650 2.4.21E-2004
Land Bond Strength@ Unsupported Component Hole
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IPC TM-650 2.4.21E-2004
Standard No.
IPC TM-650 2.4.21E-2004
Release Date
2004
Published By
IPC - Association Connecting Electronics Industries
Scope
This test method is to determine the land bond strength of unsupported holes@ after repeated soldering and unsoldering@ by mechanical pull in the perpendicular plane.
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