KS C IEC 62137-2009(2020) Environmental and endurance testing-Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
2012KS C IEC 62137-3:2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints
2009KS C IEC 62137:2009 Environmental and endurance testing-Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN