KS C IEC 62137-2009(2020)
Environmental and endurance testing-Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Standard No.
KS C IEC 62137-2009(2020)
Release Date
2009
Published By
Korean Agency for Technology and Standards (KATS)
Status
Replace By
KS C IEC 62137-3-2012(2022)
Latest
KS C IEC 62137-3-2012(2022)

KS C IEC 62137-2009(2020) history

  • 0000 KS C IEC 62137-3-2012(2022)
  • 0000 KS C IEC 62137-2009(2020)
  • 0000 KS C IEC 62137-3-2012(2017)
  • 2012 KS C IEC 62137-3:2012 Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints
  • 2009 KS C IEC 62137:2009 Environmental and endurance testing-Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN



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