HG/T 5605~5607-2019
Dimer acid type polyamide adhesive, thermally conductive potting adhesive and hot melt adhesive for bonding polyethylene to metal (2019) (English Version)
Home
HG/T 5605~5607-2019
Standard No.
HG/T 5605~5607-2019
Language
Chinese,
Available in English version
Release Date
2019
Published By
Professional Standard - Chemical Industry
Copyright ©2023 All Rights Reserved