This standard addresses semiconductor chip design. It is intended for applications utilizing standard substrates@ materials@ assembly@ and test methods as well as established semiconductor fabrication and bumping processes. Purpose The purpose is to provide flip chip design standards which are commensurate with established fabrication@ bump@ test@ assembly@ handling and application practices. Addressed are electrical@ thermal@ and mechanical chip design parameters and methodologies as well as the reliability associated with these items. These standards are intended for new designs as well as modifications of non-flip chip designs.