IEEE 3D Body Processing Industry Connections (3DBP IC): Communication, Security, and Privacy
IEEE 3D Body Processing Industry Connections (3DBP IC): Communication, Security, and Privacy

Standard No.

IEEE 3D Body Processing Industry Connections (3DBP IC): Communication, Security, and Privacy

Release Date

2019

Published By

Institute of Electrical and Electronics Engineers (IEEE)

Scope

The 3DBP IC Communications, Security and Privacy (CSP) subgroup is investigating the protection of data and records that may contain personal information, and how to ensure users and consumers expectations relative to privacy and security. The subgroup has determined that the requirements from the IEEE draft standards of P7002, P7004, and P7012 can be applied to 3DBP to help ensure security and pr...