JEDEC JESD22-B112C-2023
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

Standard No.

JEDEC JESD22-B112C-2023

Release Date

2023

Published By

/

Scope

This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.